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Etimol Etimol SUC 63 RSN

Recommended method of application
Underside cleaning in stencil printer

Solvent-based, ready for use ETIMOL

Cat.-No. 5103
30 l Canister with Etimol SUC 63 RSN by Emil Otto

Technical Data

Appearance: colourless to slightly yellow, clear liquid
Application: ready for use
ph-value: neutral
Density at 20 °C: 0.821 +/- 0.005 g/cm³
Boiling point/boiling range: 170 – 210 °C
System: water-based
Flash point: 63 °C
Operations temperature: room temperature
Reliable cleaning results with: leaded, lead-free, No Clean solder pastes, SMT-adhesives
Storage conditions (recommendation): in closed original packaging at 10 – 25 °C
Hazardous goods: No
Durability: 36 months


The solvent-based, pH-neutral cleaning medium efficiently removes residues of solder pastes containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 63 RAN optimally wets both the cleaning roller or the cleaning fleece as well as the underside of the stencil, so that constant high and qualitatively reproducible cleaning results are achieved. The mild-odour formulation combines good cleaning properties with optimal drying properties. This significantly minimises the smearing of solder paste on the underside of the stencil.

Application notes:

Depending on the printer model and manufacturer the cleaning medium is either filled undiluted directly into the reserve tank of the stencil printer at room temperature or aspirated directly from the delivery drum.

Consider approvals of equipment manufacturer!

Customer added value

  • Efficient removal of solder paste and SMT-adhesive residues from stencil underside grants repeatable and stable cleaning steps which help to achive highquality printing results
  • The water-based formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area

Packaging units