Solvent-based, ready for use ETIMOL
|colourless to slightly yellow, clear liquid
|ready for use
|Density at 20 °C:
|0.821 +/- 0.005 g/cm³
|Boiling point/boiling range:
|170 – 210 °C
|Reliable cleaning results with:
|leaded, lead-free, No Clean solder pastes, SMT-adhesives
|Storage conditions (recommendation):
|in closed original packaging at 10 – 25 °C
The solvent-based, pH-neutral cleaning medium efficiently removes residues of solder pastes containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 63 RAN optimally wets both the cleaning roller or the cleaning fleece as well as the underside of the stencil, so that constant high and qualitatively reproducible cleaning results are achieved. The mild-odour formulation combines good cleaning properties with optimal drying properties. This significantly minimises the smearing of solder paste on the underside of the stencil.
Depending on the printer model and manufacturer the cleaning medium is either filled undiluted directly into the reserve tank of the stencil printer at room temperature or aspirated directly from the delivery drum.
Consider approvals of equipment manufacturer!