Recommended method of application Automatic SMT stencil cleaning
Water-based Etimol concentrate
Cat.-No. 5107
Technical Data
Appearance:
colourless to slightly yellow, clear liquid
Application:
1:4 with DI water
ph-value:
neutral
Density at 20 °C:
0.922 +/- 0.005 g/cm³
Boiling point/boiling range:
>100 °C
System:
water-based
Flash point:
not applicable
Operations temperature:
room temperature
Reliable cleaning results with:
leaded, lead-free, No Clean solder pastes, SMT-adhesives
Storage conditions (recommendation):
in closed original packaging at 10 – 25 °C
Hazardous goods:
No
Durability:
36 months
Description
The water-based, pH-neutral cleaning concentrate is diluted in the ratio 1:4 with DI water (corresponds to ready for use Etimol SW 25 RAN) and then efficiently removes residues of solder paste containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines. The pH-neutral formula features excellent compatibility with the common stencil materials. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
Application notes:
The cleaner can be excellently rinsed with water and itself. The cleaning medium is filled in the cleaning tank of the stencil washing system at room temperature.
Note:
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Customer added value
Concentrate to dilute with DI-water, optimal rinsability
Efficient removal of solder paste and SMT-adhesive from stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results
The water-based formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area