Water-based ETIMOL concentrate
|colourless to slightly yellow, clear liquid
|1:4 with DI water
|Density at 20 °C:
|0.923 +/- 0.005 g/cm³
|Boiling point/boiling range:
|Reliable cleaning results with:
|leaded, lead-free, No Clean solder pastes, SMT-adhesives
|Storage conditions (recommendation):
|in closed original packaging at 10 – 25 °C
The water-based, slightly alkaline adjusted cleaning concentrate is diluted with DI water in the ratio 1:4 (corresponds to ready to use Etimol SW 26 RAA) and then efficiently removes residues of solder paste containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines. The formula features excellent compatibility with the stencil materials commonly used and, especially with μ-BGA and Fine-Pitch stencils, has an efficient cleaning effect.
Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
The cleaning agent can be excellently rinsed with water. The cleaning medium is filled in the cleaning tank of the stencil washing system at room temperature.
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!