Recommended method of application Automatic SMT stencil cleaning
Water-based, ready for use ETIMOL
Cat.-No. 5105
Technical Data
Appearance:
colourless to slightly yellow, clear liquid
Application:
ready for use
ph-value:
alkaline
Density at 20 °C:
0.981 +/- 0.005 g/cm³
Boiling point/boiling range:
>100 °C
System:
water-based (ready for use)
Flash point:
not applicable
Operations temperature:
room temperature
Reliable cleaning results with:
leaded, lead-free, No Clean solder pastes, SMT-adhesives
Storage conditions (recommendation):
in closed original packaging at 10 – 25 °C
Hazardous goods:
No
Durability:
36 months
Description
The water-based, slightly alkaline adjusted cleaning medium efficiently removes residues of solder pastes containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from SMT stencils in automatic washing machines. The formula features excellent compatibility with the stencil materials commonly used, and especially with μ-BGA and Fine-Pitch stencils, has an efficient cleaning effect. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaning agents, so that the intervals between bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
Application notes:
The cleaning agent can be excellently rinsed with water. The cleaning medium is filled in the cleaning tank of the stencil washing machine at room temperature.
Note:
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Customer added value
Efficient removal of solder paste and SMT-adhesive especially with μ-BGA and Fine-pitch stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results
The innovative formulation combines efficient cleaning, highest process safety and optimal occupational safety by replacing flammable and combustible solvents