Close this search box.

Alcohol- and water-based flux EO-F-001 (multiflux)

Recommended method of application
Foam and spray fluxing, selective, hand and dip soldering

No Clean-Flux for wave and selective soldering processes
Di-carboxylic acids, resin complex, halogen-free activators (WEEE/RoHS compliant)
Type ISO 9454: 2231 (2.2.3.A) \ DIN-EN 61190-1-1 (acc. J-STD-004) (IEC: ORL0)

Cat.-No. 6460

Technical Data

Appearance: colourless-light yellow, clear liquid
Hazardous goods: No
VOC: 91 %
Solids content: 2.5 wt.-%
Acid number: 18 – 21 mg KOH/g
Halogen-free: Yes
Resiny: Yes
Density at 20 °C: 0.80 – 0.82 g/ml
Activators: di-carboxylic acids, resin complex, halogen-free activators
Solvents: formulation of alcohols and ester compounds
Flash point: 12 °C
Available as concentrate: No
Durability: 12 months


EO-F-001 was developed for wave, selective, dip and hand soldering processes as well as cable assembly. The application can be carried out by all usual application methods (including foam fluxes). The solids content is 2.5 wt.-%.
In practice it has been shown that when used properly the washing of the circuit boards soldered with this flux can largely be dispensed with. Needle adapters IC testing is usually unaffected and easily done.

Customer added value

  • Wide range of applications (multiflux)
  • Very good soldering properties (capillarity, wetting)
  • Broad process window (high thermal stability, good activity over a long interval)
  • Very good residue behaviour (optically very clean, high SIR)

Packaging units

Canister: 5 l, 10 l, 20 l