No Clean-Flux for wave and selective soldering processes
Di-carboxylic acid resin complex, halogen-free activators (WEEE /RoHS compliant)
Typ ISO 9454: 2231 (2.2.3.A) DIN-EN 61190-1-1 (acc. J-STD-004) (IEC ORL0)
| Appearance: | colourless-light yellow, clear liquid |
| Hazardous goods: | Yes |
| VOC: | 91 % |
| Solids content: | 2.5 wt.-% |
| Acid number: | 18 – 21 mg KOH/g |
| Halogen-free: | Yes |
| Resiny: | Yes |
| Density at 20 °C: | 0.80 – 0.82 g/ml |
| Activators: | di-carboxylic acid resin complex, halogen-free activators |
| Solvents: | formulation of alcohols and ester compounds |
| Flash point: | 12 °C |
| Available as concentrate: | No |
| Durability: | 12 months |
EO-F-001/OVAP was developed for wave, selective, dip and hand soldering processes as well as cable assembly. The application can be carried out by all usual application methods (except foam fluxing). The solids content is 2.5 wt.-%.
In practice it has been shown that, when used properly the washing of the circuit boards soldered with this flux can largely be dispensed with. Needle adapters IC testing is usually unaffected and easily done.
