Close this search box.

Alcohol- and water-based flux EO-Y-005A (multiflux)

Recommended method of application
Wave and selective soldering

No Clean-Flux, water-based with alcohol additive
Di-carboxylic acids, low VOC, halogen-free activated, with synthetic resin, rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 2231 (2.2.3.A) \ DIN EN 61190-1-1 (acc. J-STD-004) (ORL0)

Cat.-No. 6092

Technical Data

Appearance: colourless, transparent liquid
Hazardous goods: No
VOC: 7 %
Solids content: 2.0 wt.-%
Acid number: 16 – 19 mg KOH/g
Halogen-free: Yes
Resiny: Yes
Density at 20 °C: 0.9 – 1.0 g/ml
Activators: di-carboxylic acids, synthetic resin
Solvents: water with alcohol additive
Flash point: hardly flammable
Available as concentrate: No
Durability: 12 months


EO-Y-005A is universally suitable for the wave- and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with leaded and lead-free solders, coordinated especially to the thermal requirements of the soldering process.
EO-Y-005A contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.

Recommendations for the processing of this flux:
This flux is very versatile in use and OSP-compatible. Good results are achieved with manual, wave and selective soldering as well as for cable manufacture/strand tinning. The generally applicable rule, to select as little of the applied flux as possible, is also valid for this product.
Foam fluxes: Not recommended
Spray fluxes: With the possibility of dosing the amount of fluxing agent, first set to 30 – 40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heat-sensitive paper) and then adjust to the optimal amount.
Pre-heating: With “simple” circuit boards a pre-heating temperature of 80 – 110 °C is recommended on the top side of the circuit board, with “more complex” boards a temperature of 100 – 130 °C is recommended. The operation can be carried out both in solder systems containing leaded as well as lead-free solder systems.

Customer added value

  • Wide range of applications (multiflux)
  • Very good soldering properties (capillarity, wetting)
  • Broad process window (high thermal stability, good activity over a long interval)
  • Very good residue behaviour (optically very clean, high SIR)

Packaging units

Canister: 5 l, 20 l
Other packaging units on request