No Clean-Flux, alcohol-based, partially aqueous
Di-carboxylic acids, low VOC, halogen-free activated, with synthetic resin, rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 2231 (2.2.3.A) \ (DIN EN 61190-1-1 (IEC ORL0)
| Appearance: | colourless, transparent liquid |
| Hazardous goods: | Yes |
| VOC: | 60 % |
| Solids content: | 2.0 wt.-% |
| Acid number: | 16 – 19 mg KOH/g |
| Halogen-free: | Yes |
| Resiny: | Yes |
| Density at 20 °C: | 0.86 – 0.88 g/ml |
| Activators: | di-carboxylic acids, synthetic resin |
| Solvents: | alcohol- / partial water-based |
| Flash point: | 20 °C |
| Available as concentrate: | No |
| Durability: | 12 months |
EO-Y-006A is universally suitable for the wave- and selective soldering of circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with leaded and lead-free solders, coordinated especially to the thermal requirements of the soldering process.
EO-Y-006A contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.
Recommendations for the processing of this flux:
This flux is very versatile in use and OSP-compatible. Good results are achieved with manual, wave and selective soldering as well as for cable manufacture/strand tinning. The generally applicable rule, to basically select as little of the applied flux as possible, is also valid for this product.
Foam fluxes: Not recommended
Spray fluxes: With the possibility of dosing the amount of fluxing agent, first set to 30 – 40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heat-sensitive paper) and then adjust to the optimal amount.
Pre-heating: With “simple” circuit boards a pre-heating temperature of 80 – 110 °C is recommended on the top side of the circuit board, with “more complex” boards a temperature of 100 – 130 °C is recommended. The operation can be carried out both in solder systems containing leaded as well as lead-free solder systems.
