Recommended method of application Wave, selective, manual and repair soldering, dip soldering
No Clean-Flux, alcohol-based
Di-carboxylic acids, synthetic resin, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: L0 (REL0)
Cat.-No. 6005
Technical Data
Appearance/smell:
colourless to light yellow, clear liquid
Hazardous goods:
Yes
Solids content:
1.8 wt.-%
Acid number:
15 – 18 mg KOH/g
Halogenide-free:
Yes
Resinous:
Yes
Available as concentrate:
Yes
Density at 20 °C:
0.793 (+/- 0.003) g/ml
Flash point:
12 °C
Durability:
24 months
Description
EO-B-004 is a multiflux intended for wave (spray fluxes), selective, immersion or manual soldering processes, it consists of alcohol-based solvents, synthetic resin and halogen-free activators. With a 1.8 wt.-% solids content this variant was developed especially for full-tunnel nitrogen applications. It features a wide processing window and great temperature stability to guarantee a better soldering result than that obtained with traditional adipic acid solutions under full nitrogen. Soldering results and cleanliness are very good.
Practice has shown, that no washing is needed for PCBA properly soldered with EO-B-004.
Customer added value
Wide range of applications (multiflux)
Very good soldering properties (capillarity, wetting)
Broad process window (very high thermal stability, good activity over a long interval)
Recommended for N2-systems
Very low solids content
High surface resistance of flux residues (SIR) (even with selective special testing)