Recommended method of application Wave, and selective, manual and repair soldering, dip soldering
No Clean-Flux, alcohol-based
Di-carboxylic acids, halogenide-free, resin-free (WEEE/RoHS compliant)
Type ISO-9454: 2131 // DIN EN 61190-1-1: L0 (ORL0)
Cat.-No. 6023
Technical Data
Appearance/smell:
colourless, clear liquid
Hazardous goods:
Yes
Solids content:
3.0 wt.-%
Acid number:
23 – 26 mg KOH/g
Halogenide-free:
Yes
Resinous:
No
Available as concentrate:
Yes
Density at 20 °C:
0.795 (+/- 0.003) g/ml
Flash point:
12 °C
Durability:
24 months
Description
EO-B-006B is a No Clean-Flux formulated to be free of halogen and resin/rosin. It is suitable for usage in the wave-selective domain as well as for manual-soldering processes. EO-B-006B leaves behind no staining and sticky residues. The activators are designed for higher temperatures without hindering their effectiveness. It can be applied via of the usual application methods (except for foam fluxing). The solids content amounts to 3 wt.-%.
Customer added value
Wide range of applications (multiflux)
Very good soldering properties (capillarity, wetting)
Available as concentrate (granulate)
Broad process window (very high thermal stability, good activity over a long interval)
Very good residue behaviour (very clean, high SIR)
Successful passing of internal test (SIR selective)