Recommended method of application Wave, selective, manual and repair soldering, dip soldering
No Clean-Flux, alcohol-based
Di-carboxylic acids, minimal resin content, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 2231 // DIN EN 61190-1-1: L0 (ORL0)
Cat.-No. 6016
Technical Data
Appearance/smell:
colourless to light yellow, clear liquid
Hazardous goods:
Yes
Solids content:
1.9 wt.-%
Acid number:
15 – 18 mg KOH/g
Halogenide-free:
Yes
Resinous:
Yes
Available as concentrate:
Yes
Density at 20 °C:
0.793 (+/- 0.003) g/ml
Flash point:
12 °C
Durability:
12 months
Description
Like all multifluxes the EO-B-007A can be used for wave (spray fluxes) as well as for selective, manual and dip soldering. The A version has a low 1.9 wt.-% solids content. This variant was developed especially for full-tunnel nitrogen applications. It features a wide processing window and great temperature stability to guarantee a better soldering result than that obtained with traditional adipic acid solutions under full nitrogen. Soldering results and cleanliness are very good.
Practice has shown, that no washing is needed for PCBs properly soldered with EO-B-007A.
Customer added value
Wide range of applications (multiflux)
Very good soldering properties (capillarity, wetting)
Available as concentrate (granulate)
Broad process window (very high thermal stability, good activity over a long interval)
Very good residue behavior (very clean, high SIR)
Successful passing of internal test (SIR selective)