Recommended method of application Wave, selective, manual and repair soldering, dip soldering
No Clean-Flux, alcohol-based
Di-carboxylic acids, low resin content, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: L0 (REL0)
Cat.-No. 6019
Technical Data
Appearance/smell:
colourless to light yellow, clear liquid
Hazardous goods:
Yes
Solids content:
4.0 wt.-%
Acid number:
32 – 35 mg KOH/g
Halogenide-free:
Yes
Resinous:
Yes
Available as concentrate:
Yes
Density at 20 °C:
0.796 (+/- 0.004) g/ml
Flash point:
12 °C
Durability:
12 months
Description
At 4 wt.-% EO-B-008 has a high solids content. EO-B-008 was especially developed for short wave soldering systems where the circuit board spends dwell time in the preheating phase. The subsequent soldering procedure occurs in a very active wave. Thanks to EO-B-008, the assembled printed circuit board shows very good soldering results with a very clean surface after the soldering procedure.
Customer added value
Very good soldering properties (capillarity, wetting)
Broad process window (high thermal stability, good activity over a long interval)