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Alcohol-based flux GSP-2633/RX

Recommended method of application
Wave soldering, dip soldering and cable assembly

No Clean-Flux, alcohol-based
Di-carboxylic acid complex, halogen-free (WEEE/RoHS compliant)
Type ISO 9454: 1231 (1.2.3.A) // DIN-EN 61190-1-1 : L0 (J-STD-004) (IEC REL0)

Cat.-No. 3061
3061-Kanister-GSP-2633-RX-EN_520x520px

Technical Data

Appearance/smell: colourless to reddish clear liquid
Hazardous goods: Yes
Solids content: 2.6 wt.-%
Acid number: 22 – 26 mg KOH/g
Halogenide-free: Yes
Resinous: Yes
Available as concentrate: No
Density at 20 °C: 0.798 (+/-0.005) g/ml
Flash point: 12 °C
Durability: 12 months

Description

GSP-2633/RX is a flux of the latest generation. It is a high performance No Clean-Flux based on alcohol with di-carboxylic acid activator complex and synthetic resin. This flux was used for selective and wave soldering process, as well as for dip soldering process and cable strands tining developed. The application can be carried out by any usual application method (inclusive foams). This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product. 

Spray fluxing: When dosing, the amount of flux initially to 15 – 30 ml/min. adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount. 

Foam fluxing (foam flux application): The compressor output should be even, so that a stable and fine-pored foam crown is achieved. When compressed air supply from the network, the interposition of a water and oil separators and at least one pressure reducer is required. Optimal is an air pressure in the range of 0.6 – 0.8 bar. Fine-pored foam stones or pipes (10 – 20 μm) facilitate foam flow. The nozzle slot should not be more than 15 mm. Side-mounted, perforated support plates promote the stability of the foam. After the foam has been flown, it is recommended to blow off with air to evenly distribute the flux and retain excess amounts. 

Density correction: The Flux Thinner “K-113”, Cat.-No. 1003, is available for this purpose. 

Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems. 

Customer added value

  • Wide range of applications
  • Very good soldering properties (capillarity, wetting) 
  • Broad process window (very high thermal stability, good activity over a long interval) 
  • Very good residue behavior (very clean, high SIR) 
  • Successful passing of internal test (SIR selective) 

Packaging units