No Clean-Flux, alcohol-based
Di-carboxylic acids, synthetic resin, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1 (acc. J-STD-004) (IEC: REL0)
| Appearance/smell: | colourless to light yellow, clear liquid |
| Hazardous goods: | Yes |
| Solids content: | 2.5 wt.-% |
| Acid number: | 21 – 25 mg KOH/g |
| Halogenide-free: | Yes |
| Resinous: | Yes |
| Available as concentrate: | No |
| Density at 20 °C: | 0.794 (+/-0.003) g/ml |
| Flash point: | 12 °C |
| Durability: | 12 months |
S-250/FR is universally suitable for wave soldering. It features special additives to ensure a stable, fine-pored foam head. It is used successfully for a wide range of systems and wave types in both leaded and lead-free processes. Its high temperature stability and very good activity over a wide temperature range ensures a wide processing window with best soldering results. The surfaces are very clean after soldering, the SIR is above the standards. S-250/FR is suitable for foam fluxing and not recommended for selective and manual soldering (see also product matrix). Practice has shown, that in most cases no washing is needed for PCBA properly soldered with S-250/FR. The IC test with needle adapters is generally not affected.
