No Clean-Flux, water-based
di-carboxylic acid complex, VOC-free, halogen-free (WEEE/RoHS compliant) [OSP compatible]
Type ISO-9454: 2131 DIN EN 61190-1-1 8 (acc. J-STD004) (IEC: ORL0)
| Appearance: | colourless, transparent liquid |
| Hazardous goods: | No |
| VOC: | 0.0 % |
| Solids content: | 5.0 wt.-% |
| Acid number: | 40 – 46 mg KOH/g |
| Halogen-free: | Yes |
| Resiny: | No |
| Activators: | di-carboxylic acid complex, VOC-free, halogen-free |
| Additive: | wetting agent, alcohol compound <10 % |
| Solvents: | water-based |
| Flash point: | non-flammable |
| Available as concentrate: | Yes |
| Durability: | 12 months |
EO-G-006 is universally suitable for wave, hand and selective soldering of PCBs and complies with specification DIN-EN 61190-1-1: L0. Accordingly, it contains organic, halogen-free activating additives in a combination specially tuned to the thermal requirements of the soldering processes.
EO-G-006 is based on a novel formulation to stabilise and improve the application process compared to conventional water or partial water based fluxes. It can be applied by brushing, spraying, dipping etc. (except for foam application).
EO-G-006 is a water-based flux and totally free from corrosion action. The solids content is 5 % by weight.
Instructions for use:
This flux is very versatile and OSP compatible.
Foam fluxes: Not recommended
Spray fluxing: If dosing is possible first adjust the flux quantity to 10 – 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: For “simple” PCBs a preheating temperature of 80 – 110 °C is recommended, for “more complex” PCBs 110 – 130 °C on the top side of the PCB. It can be used in both leaded and lead-free solder systems.
