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Flux gels Flux gel EO-B-008

Recommended method of application
Repair work on printed circuit boards, dip tinning

No Clean-Flux gel
Highly active, halide-free activated (WEEE/RoHS compliant)
Type ISO-9454: 1231 DIN EN 61190-1-1 (gem. J-STD004): REL0

Cat.-No. 4698

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Flux Gel EO-B-008, syringe

Description

This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-B-008.

FLUX GEL EO-B-008 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux. The processing of FLUX GEL EO-B-008 can be done by hot air or soldering iron.
In individual cases, which must be checked by the user, this flux gel can also support the wave soldering of critical components. The application is carried out as described above.

Customer added value

  • Ideal when using the flux series EO-B-008, standardised activator base
  • Ideal for applications according to IPC / IPC 610
  • Perfect soldering results
  • Economical consumption
  • Even contaminated pads and component legs are activated
  • No crystallisation, paste remains homogeneous and stable
  • Careful and targeted dosing
  • Metal dosing needle is thermally resilient and can be used during a hot air or soldering iron during application
  • Leaves no sticky residue
  • Residues can be easily removed with DI water (H2O)

Packaging units

Syringe: 5 ml, 10 ml
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