Recommended method of application Manual soldering processes, repair work on printed circuit boards, reflow process, dip tinning, numerous other application processes
No Clean-Flux gel
Resin-based, halogenide-free activated (WEEE/RoHS compliant)
Type ISO-9454: 1231 DIN EN 61190-1-1 (acc. J-STD 004) L0 [IEC: REL0]
Cat.-No. 3845
Product similar to the image displayed.
Description
The No Clean-Flux gel EO-FG-001 is a water-soluble high performance flux especially suitable for hand soldering, dip soldering and strand tinning.
This flux gel is resin-based and was developed for manual soldering and repair work on printed circuit boards.
EO-FG-001 contains highly effective activators tailored to the formulation and is characterized, among other things, by high activity and good wetting properties. Due to these properties, the flux gel should be applied sparingly. The gel application can be carried out with a wide variety of application options, for example manually with the aid of a metering bottle (this enables an accurate application or positioning of the flux)
Customer added value
Perfect soldering results
Good wetting and spreading properties
Economical consumption
No crystallisation, paste remains homogeneous and stable
Careful and targeted dosing
Post-cleaning is not mandatory, should residues arise, they may remain on the assembly