Recommended method of application Manual soldering processes, repair work on printed circuit boards, reflow process, dip tinning, numerous other application processes
No Clean-Flux gel
Highly effective, resin-free, VOC-free, halogen activated (WEEE/RoHS compliant)
Type ISO-9454: 2232 DIN EN 61190-1-1: ORL1
Cat.-No. 3843
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Description
The No Clean flux gel EO-FG-005 is especially suitable for hand soldering, SMD soldering and strand tinning.
This flux gel has been developed for a variety of soldering processes, as well as repair work on printed circuit boards, both for manual processes and for automation processes.
The basis is an organic, strong-acting activator complex, which is formulated resin-free. EO-FG-005 is highly concentrated and is characterized among other things by high activity, as well as good wetting and spreading. Due to these properties, the flux gel should be applied sparingly. The gel application can be carried out with a wide variety of application options, for example manually with the aid of a metering bottle (this enables an accurate application or positioning of the flux).
Customer added value
Perfect soldering results
Highly effective
Economical consumption
Even contaminated pads and component legs are activated
No crystallisation, paste remains homogeneous and stable
Careful and targeted dosing
Leaves no sticky residue
Subsequent cleaning is not mandatory; if residues are left behind residues may remain on the assembly