Recommended method of application Printing, dispensing
The high-quality SMD adhesives from IQ-Bond are suitable for double-sided equipped printed circuit boards, SMT applications as well as mixed large and small components
Technical Data
Cure:
1–2 min at 150 °C
5 min at 120 °C
Viscosity (mPa,s):
150,000
Hardness:
85 D
Worklife:
10 days
Description
The use of adhesives has for years been an integral part of electronics production. Adhesives are commonly used especially in the areas of the bonding and fixing of electronic components. In the past the properties such as temperature stability, electrical conductivity, degassing, mechanical stability, durability and processability have continuously improved.
Customer added value
Quick curing in comparison to conventional SMD adhesives which leads to quicker throughput processes
High velocity pressure and output as well as dosing applications