Recommended method of application Automatic nozzle cleaning of selective soldering systems
Electronics nozzle cleaner for cleaning the solder nozzles of selective soldering systems
Cat.-No. 2952
Technical Data
Appearance:
colourless, light amber-coloured liquid
ph-value:
115 – 135 mg KOH/g
Density at 20 °C:
0.84 – 0.86 g/cm³
Activators:
Di-carboxylic acid-resin complex, halogen-free
Flash point:
12 °C
Substances:
mixture of monohydric alcohols
Storage conditions (recommendation):
cool, dry and light protected at 5 – 25 °C
Durability:
12 months
Description
EO-NCF-002 is activated on an organic base and halogen-free. It was developed especially for the cleaning of solder nozzles. Due to its activation complex, this nozzle cleaner removes scaling and scraping deposits on solder nozzles of selective soldering machines.
Processing notes: With light to moderate deposits on the nozzle: Switch off selective wave, wet nozzle with EO-NCF-002, allow to act and switch the wave back on again after approx. 2–3 minutes (possibly also allow the wave to run “lightly” for 2–3 minutes and then bring up to operating performance).
With heavy deposits on the nozzle: Switch off selective wave, wet nozzle with EO-NCF-002, allow to act and switch the wave back on again after approx. 2–3 minutes. Afterwards remove the deposits with a brush or similar and then switch the wave back on again. If the deposits have not been sufficiently removed, repeat procedure.
Customer added value
Very good cleaning effect for scaling and dross deposits on solder nozzles of selective soldering systems