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Solder paste Solder Paste B-26

Recommended method of application
Conventional soft soldering of copper and brass materials

Soft soldering flux based on inorganic halogens, zinc-free
Type ISO 9454: 2.2.2.C

Cat.-No. 2719
Illustration of plastic tin with 100 g B-26 solder paste Emil Otto

Technical Data

Appearance:colourless to light yellow paste
Density at 20 °C:0.9 g/cm³
ph-value:not useable
Water solubility:poor
Melting point:90 °C
Residues:must be removed
Durability:24 months

Customer added value

  • Very good wetting properties
  • Very good soldering properties, large working temperature range (150 – 260 °C)
  • Good handling, drip-free application, easily metered
  • Low smoke and odour formation
  • Environmentally friendly due to lack of heavy metals and freedom from organic solvents
  • Very strongly activated but minimal tendency to corrode

Packaging units

Tin: 100 g, 250 g, 500 g
Other packaging units on request
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