No Clean-Flux, alcohol-based
Di-carboxylic acid complex, synthetic resin, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: (acc. J-STD 004): [IPC: REL0]
| Appearance: | colourless to yellowish, clear liquid |
| Solids content: | 1.9 – 2.1 wt.-% |
| Acid number: | 16 – 19 mg KOH/g |
| Density at 20 °C: | 0.793 (+/- 0.003) g/ml |
| Activators: | di-carboxylic acid complex with synthetic resin |
| Solvent: | short chain alcohols |
| Flash point: | 12 °C |
| Durability: | 24 months |
| Storage conditions: | at 5 – 25 °C, cool and dry, originally sealed, fire protection and ex-protective regulations must be observed |
| Working temperature: | at room temperature (usually 20 – 25 °C) |
EO-B-013A is universally suitable for wave, selective and hand soldering of PCBs and complies with specification DIN-EN 61190-1-1: L0. Accordingly, it contains organic, halogen-free activating additives in a combination specially tuned to the thermal requirements of the soldering processes. This variant was specially developed for full-tunnel nitrogen applications and guarantees significantly better soldering results than conventional adipic acid solutions under full nitrogen thanks to a wide process window and high temperature stability.
EO-B-013A can be applied by brushing, spraying, dipping etc. The solids content is 2 %. EO-B-013A is totally free from corrosion action.
Information on the ingredients (hazardous substances), safe handling, storage, transport and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).
Recommendations for the processing of this flux:
This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product.
Recommended parameters for wave soldering.
Spray fluxing: When dosing, the amount of flux initially to 30 – 50 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.
