No Clean-Flux, water-based
Di-carboxylic acid complex, VOC-free, halogen-free (WEEE/RoHS compliant) [OSP compatible]
Type ISO-9454: 2131 DIN EN 61190-1-1 (acc. J-STD004): L0 (IPC: ORL0)
| Appearance: | colourless, transparent liquid |
| Hazardous goods: | No |
| VOC: | 0.0 % |
| Solids content: | 3.9 – 4.1 wt.-% |
| Acid number: | 32 – 37 mg KOH/g |
| Halogen-free: | Yes |
| Activators/resin: | di-carboxylic acid complex, VOC-free, halogen-free |
| Additive: | wetting agent, alcohol compound <10 % |
| Solvents: | water with additives |
| Available as concentrate:: | Yes |
| Flash point: | non-flammable |
| Durability: | 12 months |
EO-G-006C is a No Clean flux universally suitable for wave, hand and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with leaded and lead-free solders that is specially adapted to the thermal requirements of the soldering process.
EO-G-006C is based on a new formulation to stabilise and improve the application process compared to conventional water or partially water-based fluxes.
EO-G-006C is a water-based electronic flux and non-corrosive. The solids content is 4 % by weight.
Instructions for use:
This flux is very versatile and OSP compatible.
Foam fluxing: Not recommended
Spray fluxing: If dosing is possible, first set the flux quantity to 20 – 30 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: For ‘simple’ PCBs, a preheating temperature of 80 – 110 °C is recommended, for ‘more complex’ PCBs 110 – 130 °C on the top side of the PCB. It can be used in both leaded or lead-free solder systems.
