Elektronik

Alcohol-based flux EO-B-026C (multiflux)

Recommended method of application
Wave, selective and manual soldering processes as well as cable assembly

No Clean-Flux, alcohol-based
Di-carboxylic acid-resin complex, halide-free (WEEE/RoHS compliant) [OPS compatible]
Type ISO 9454: 1131 // DIN-EN 61190-1-1 (acc. to J-STD-004): L0 (IPC : ROL0)

Cat.-No. 6159
No Clean-Flux EO-B-026C alcohol-based

Technical Data

Appearance:colourless to amber, clear liquid
Solids content:3.8 – 4.2 Gew.-%
Acid number:27 – 31 mg KOH/g
Halide-free:Yes
Resinous:Yes
Activators:di-carboxylic acid-resin complex
Density at 20 °C:0.795 (+/- 0.003) g/ml
Flash point:12 °C
Solvents:short chain alcohols
VOC:96 %
Durability:12 months
Storage conditions:cool and dry at 5 – 25 °C
Working temperature:at room temperature (20 – 25 °C)

Description

EO-B-026C is a flux of the latest generation. It is a high-performance No Clean-Flux based on alcohol with di-carboxylic acid activator complex and rosin. This flux was used for selective and wave soldering processes, as well as for dip soldering process and cable-strands-tinning developed. The application can be carried out by any usual application method (except foams). EO-B-026C is totally free from corrosion action.

Instructions for use:
This flux is very versatile and OPS-compatible. There are good results for manual, wave and selective soldering.
The general rule of applying fluxes applied in principle as low as possible also applies to this product.

Recommendation from practice:
Sprayfluxing: If possible, try at first a quantity of 20 – 35 ml/min. and observe the distribution of the flux. After that, correct the quantity. Air-pressure: 18 – 20 l/min.

Preheating (if preheating system is used): Entering the solder-wave, the temperature on the topside of the pasteboards should be 80 – 110 °C, dependent on type of boards, lay-out etc. – in case of using lead-free solders, preheating temperatures of 100 – 130 °C on the topsides are possible.

Customer added value

  • Wide range of applications
  • Very good soldering properties (capillarity, wetting)
  • Virtually residue-free despite higher solids content
  • Best soldering results even with overaged or overlayered PCBs and components
  • Wide process window (very high thermal stability, good activity over a long interval)
  • Successful passing of internal test (SIR selective)
  • Best results, especially with OSP and ENIG soldering surfaces

Packaging units

Canister: 5 l, 20 l
Other packaging units on request