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Comparison list

Flux gels Flux gel EO-B-026

Recommended method of application
Repair work on printed circuit boards, dip tinning

No Clean-flux gel
Di-carboxylic acid-resin complex, halide-free (WEEE/RoHS compliant) [OPS compatible]
Type ISO 9454: 1131 // DIN-EN 61190-1-1 (acc. to J-STD-004): L0 (IPC : ROL0)

Emil Otto No Clean-Flux gel EO-B-026

Description

This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-B-026 and variants EO-B-026A, EO-B-026B and EO-B-026C.

Flux gel EO-B-026 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux.
The processing of flux gel EO-B-026 can be done by hot air or soldering iron.

Customer added value

  • Ideal when using type of fluxes EO-B-026/(A-C), uniform activator base
  • Recommended for applications according to IPC / IPC 610
    Perfect soldering results
  • Economical in consumption
  • Also contaminated (old) pads and component pins are activated
  • Paste is stable and shows no signs of polymerization (no sticking)
  • Careful and targeted dosage
  • Metal dosing needle is thermally resilient and can be used during use be used with the hot air or soldering iron
  • Leaves no sticky residue

Packaging units

Syringe: 5 ml, 10 ml
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