"Components with nickel or brass pins are difficult to solder, since even long wetting times or high temperatures do not lead to success. Furthermore, the circuit board and the components in the direct surrounding area can be damaged. This applies to both component soldering and reworking."
Emil Otto has therefore developed a whole range of products to meet these challenges.
THT components with nickel and brass pins are frequently used in durable electronic devices, whereby the brass pins in particular offer high mechanical strength. For example, in aerospace and military applications. In addition to reliability, these applications require resistance to demanding environmental conditions.
“In the aerospace industry, THT components with nickel pins are particularly in demand due to their high reliability and resistance to corrosion and wear, since electronic components have to withstand extreme conditions. Nickel is the preferred choice due to its protective properties. However, reliability under extreme environmental conditions is also crucial for military applications. THT components with nickel pins are therefore frequently found in military communication devices and other critical systems. However, the processing presents some challenges.”
As nickel oxide is a very good insulator, nickel is difficult to process. The insulating property acts like a barrier, which makes soldering very difficult. Conventional fluxes reach their limits in this case, which is why special fluxes are required. These not only have to enable processing, but also protect the nickel surface from oxidation during storage. Emil Otto has developed suitable fluxes consisting of a carboxylic acid complex for this purpose.
“A suitable flux has to have good soldering properties and should not impair the wave or selective soldering process. Instead, it is essential to be able to solder reliably with the specified parameters. Consequently, there are many different requirements for a product that is only intended to support the soldering of a specific type of pin. At the same time, there are aids that are much less obvious in their application than their effect would suggest. For instance, dipping the pins in solder consisting of a carboxylic acid complex not only removes the oxide layer. It also protects the pins from further soiling and surface changes. This allows immediate processing or storage."
Emil Otto has also developed product solutions for reworking, for example when replacing components for repair, which can be used to reliably extend and expand the product life cycle. For example, with the flux paste EO-FLUX-Paste (BIO-BASED) FP-BIO-001/2 “EO B-Power”. “Security and defense systems in particular are often exposed to harsh, demanding environments over long periods of time. If the electronics fail, they have to be replaced. This sometimes affects complete assemblies, individual components or just the connector of a cable. This is where Emil Otto’s flux pastes can be used.
EO-FLUX-Paste (BIO-BASED) FP-BIO-001 „EO B-Power”
High-quality electronics production and repair work on PCBA
No Clean-Flux paste “BIO-BASED” with a new and high effective activator formulation
Rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 1131 (1.1.3.C) // EN 61190-1-1 (J-STD-004: L0) // IEC: RO-BIO L0
EO-FLUX-Paste (BIO-BASED) FP-BIO-002 „EO B-Power”
High-quality electronics production and repair work on PCBA
No Clean-Flux paste “BIO-BASED” with a new and high effective activator formulation
Rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 1131 (1.1.3.C) // EN 61190-1-1 (J-STD-004: L0) // IEC: RO-BIO L0
These no-clean flux pastes have been specially developed for high-quality electronics production and the repair of PCBs. Both pastes are “BIO-BASED” and formulated with a B-POWER activator complex. The highly effective and unique “B-Power” activator complex consists of specifically balanced natural, high-purity substances. The main components consist of special waxes and resins that contain neither colophony resins nor synthetic resins. FP-BIO-001 and 002 are characterized by a highly soldering process-optimized activity and very good wetting and penetration properties, allowing the pastes to be dispensed extremely sparingly.