No Clean-Flux gel
Highly active, resin/rosin-free, activated without halide and water-soluble (WEEE/RoHS compliant)
Type ISO-9454: 2131 \ DIN EN 61190-1-1 (gem. J-STD004): ORL0
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This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-B-006 EO-B-006 (A-C,X). FLUX GEL EO-B-006 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux. The processing of FLUX GEL EO-B-006 can be done by hot air or soldering iron.
• Ideal when using type of fluxes EO-B-006 (A-C/X), uniform activator base
• Recommended for applications according to IPC / IPC 610
• Perfect soldering results
• Economical in consumption
• Also contaminated (old) pads and component pins are activated
• Paste is stable and shows no signs of polymerization (no sticking)
• Careful and targeted dosage
• Metal dosing needle is thermally resilient and can be used during use be used with the hot air or soldering iron
• Leaves no sticky residue
• Returns can be easily removed with DI water (H2O) (ideal at 40 – 60 °C, also USB suitable)
