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Flux paste EO-FP-003

Recommended method of application
Repair work on printed circuit boards, dip tinning

No Clean-Flux paste
Halogen-free activators (WEEE/RoHS-konform)
Type ISO-9454: 1131 (1.1.3.C) DIN EN 61190-1-1 (gem. J-STD-004:L0) (IEC: ROL0)

Cat.-No. 4683
FP-003_520x520px

Technical Data

Appearance/smell:amber coloured, waxy, mild paste
Density at 20 °C:0.9 – 1.0 g/ml
Activators/resin:halogen-free
Viscosity (DIN 51810-1):highly viscous
Flash point:> 80 °C
Durability:12 months

Description

The No Clean-Flux paste EO-FP-003 was specially developed to repair assemblies. Among other things, it is characterised by strong activity and very good wetting and spreading behaviour. Due to these properties, the paste can be dispensed very sparingly. The paste is applied via a stainless steel dosing needle (optionally also a plastic dosing needle).

The flux paste can be processed, for example, using hot air and soldering irons, but also with a mini-wave.

Customer added value

  • Ideal for applications according to IPC / IPC 610
  • Perfect soldering results
  • Economical in consumption
  • Even contaminated pads and component legs are activated
  • Careful and targeted dispensing
  • Supports wave soldering of critical components (e.g. brass connectors); application is as described above

Packaging units

Syringe: 5 ml, 10 ml
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