Recommended method of application Manual, repair and dip soldering, special applications, suitable for SMD-components as well as SnPb and Pb-free alloys
No Clean-Flux paste for electronic with halogen-free activators
Di-carboxylic acids, synthetic resin, halogen-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 (1.2.3.C) // DIN EN 61190-1-1 (acc. J-STD-004): REL0
The flux paste EO-FP-002 was specially developed for repair work on printed circuit boards and is characterised by high activity and very good wetting and spreading behaviour. Due to these properties, the paste is extremely economical to dose. The paste is applied via plastic tips, which enable precise dosing and positioning of the paste and offer the advantage over steel needles that the printed circuit boards cannot be scratched. The flux paste can be processed with hot air- and soldering irons.
Customer added value
Perfect soldering results
Economical consumption
Also contaminated pads and pins are activated
Careful and targeted dosage
Broad process window (very high thermal stability, very good activity over long interval)
High-viscosity paste with which SMD components can be soldered extremely well due to their temperature stability