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Flux paste EO-FP-002

Recommended method of application
Manual, repair and dip soldering, special applications, suitable for SMD-components as well as SnPb and Pb-free alloys

No Clean-Flux paste for electronic with halogen-free activators
Di-carboxylic acids, synthetic resin, halogen-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 (1.2.3.C) // DIN EN 61190-1-1 (acc. J-STD-004): REL0

Cat.-No. 4682

Technical Data

Appearance/smell: amber, opaque, waxy paste
Smell: mild
Solids content: very high
Density at 20 °C: 0.9 – 1.0 g/ml
Activators: di-carboxylic acids, synthetic resin, halogen-free
Flash point: > 80 °C
Viscosity (DIN 51810-1): highly viscous
Durability: 12 months


The flux paste EO-FP-002 was specially developed for repair work on printed circuit boards and is characterised by high activity and very good wetting and spreading behaviour. Due to these properties, the paste is extremely economical to dose. The paste is applied via plastic tips, which enable precise dosing and positioning of the paste and offer the advantage over steel needles that the printed circuit boards cannot be scratched. The flux paste can be processed with hot air- and soldering irons.

Customer added value

  • Perfect soldering results
  • Economical consumption
  • Also contaminated pads and pins are activated
  • Careful and targeted dosage
  • Broad process window (very high thermal stability, very good activity over long interval)
  • High-viscosity paste with which SMD components can be soldered extremely well due to their temperature stability

Packaging units

Cartridge: 350 g
Syringe: 5 ml, 10 ml