Solder pastes / solders

EO-FLP-001

Recommended method of application: Repair work on circuit boards, tinning of components on PCBA

No Clean solder paste for the electronics with metal alloy component (SAC 305)
Lead-free and halide-free activators (WEEE/RoHS compliant)
Type ROL0 acc. ANSI/J-STD-004 (IPC-TM-650)

Cat.-No. 4611
EmilOtto_EO-FLP-001_520x520px_EN

Description

This liquid solder paste (lead-free) with metal alloy component (>80 %) has been developed for repair work on circuit boards and components. It is low-viscous and is distinguished, among other things, by a high level of activity as well as good wetting and spread. Due to these properties the paste should be applied sparingly. The paste is normally applied with a brush, but can also be applied individually. The processing of EO-FLP-001 can be carried out with a hot-air or soldering iron.  

Important information: This paste must be stirred before use! 

In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste. The paste is applied as previously described. 

Customer added value

  • Highly effective
  • Perfect soldering results
  • Very wide process window
  • Versatile application possibilities
  • Economical in use
  • Contaminated pads and pins are also activated
  • No crystal formation, paste remains homogeneous and stable
  • Careful and targeted dosing
  • Low odour, hardly any development of vapors

Packaging units

  • Brush bottle 50 g