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Solder pastes / solders EO-FLP-005

Recommended method of application
Repair work on circuit boards, tinning of components on PCBA

No Clean solder paste for the electronics with metal alloy component
Lead-free and halide-free activators, low-melting (WEEE/RoHS compliant)
Type: ORL0 acc. ANSI/J-STD-004 (IPC-TM-650)

Cat.-No. 4615


This liquid solder paste (lead-free) with metal alloy component SnAg 0.4 Bi 57.6 (>80 %) has been developed for repair work on circuit boards and components. It is low-viscous and is distinguished, among other things, by a high level of activity as well as good wetting and spread. Due to these properties the paste should be applied sparingly. The paste is normally applied with a brush, but can also be applied individually. The processing of EO-FLP-005 can be carried out using hot-air or soldering iron.  

Important information: This paste must be stirred before use! 

In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste. The paste is applied as previously described. 

Customer added value

  • Low-melting (melting point of solder: 137 °C, working temperature 190 – 350 °C)
  • Perfect soldering results
  • Very wide process window
  • Versatile application possibilities
  • Economical in use
  • Contaminated pads and pins are also activated
  • No crystal formation, paste remains homogeneous and stable
  • Careful and targeted dosing
  • Low odour, hardly development of vapours

Packaging units

Brush bottle: 50 g