No Clean solder paste for the electronics with metal alloy component
Lead-free and halide-free activators, low-melting (WEEE/RoHS compliant)
Type: ORL0 acc. ANSI/J-STD-004 (IPC-TM-650)
This liquid solder paste (lead-free) with metal alloy component SnAg 0.4 Bi 57.6 (>80 %) has been developed for repair work on circuit boards and components. It is low-viscous and is distinguished, among other things, by a high level of activity as well as good wetting and spread. Due to these properties the paste should be applied sparingly. The paste is normally applied with a brush, but can also be applied individually. The processing of EO-FLP-005 can be carried out using hot-air or soldering iron.
Important information: This paste must be stirred before use!
In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste. The paste is applied as previously described.