Solder pastes / solders

EO-RP-001

Recommended method of application: Repair work on circuit boards, tinning of components on PCBA

No Clean rework paste for the electronics with metal alloy component (SAC 305)
Lead-free and halogen-free activators (WEEE/RoHS compliant)
Type ORL0 acc. ANSI/J-STD-004 (IPC-TM-650)

Cat.-No. 4600
No clean rework paste EO-RP-001

Description

These rework paste (lead-free) with metal alloy component [Sn 96.5 Ag 3.0 Cu 0.5] (>85 %) have been developed for repair work on circuit boards and components and are distinguished, among other things, by a high level of activity as well as good wetting and spread. Due to these properties the paste should be applied sparingly. The paste is applied with a dosing syringe via a metal dosing needle. This enables a precise dosing resp. positioning of the paste.

The processing of the rework paste can be carried out using hot-air or soldering iron. In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste.
The paste is applied as described.

Customer added value

• Highly effective
• Perfect soldering results
• Very wide process window
• Versatile application possibilities
• Economical in use
• Contaminated pads and pins are also activated
• No crystal formation, paste remains homogeneous and stable
• Careful and targeted dosing
• Low odour, hardly development of vapors

Packaging units

  • Syringes with 10 g and 20 g (including dosing syringe and cap)